HY510 Black Heat Sink CompoundProduct has been kindly sponsored by taydaelectronics.com
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product specificationsGeneral
Type: Heat Sink Compound (Thermal Paste) Architecture: For all electronics Model: HY510 Material: Silicone Fluid Paste Colour: Black Volume: 10 mL Physical Form Texture: Greasy Power Not applicable. Weight and Size Dimensions Product Weight (including syringe): 38g Product Size of unused syringe (L x W x H): 36 x 21 x 175 mm |
product reviewThermal paste is used as a heat sink compound for thermal coupling of electronic devices and heatsinks. However, I really enjoy using Tayda's heat sink compound product for these following reasons:
1. This product has high thermal conductivity to transfer heat between materials like aluminium, silicon etc. 2. The paste has a low bleed property, so that it won't easily seep onto other surfaces. 3. This thermal paste gives a very stable performance under high temperatures, meaning that thermal transfer will take place efficiently without any complications in the way. |
TAYDA ELECTRONICS PRODUCT PAGE
Check out the product here: https://www.taydaelectronics.com/heat-sink-compounds-hy510-black.html
