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 HY510 Black Heat Sink Compound

Product has been kindly sponsored by taydaelectronics.com
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product specifications

General
Type: Heat Sink Compound (Thermal Paste)
Architecture: For all electronics
Model: HY510
Material: Silicone Fluid
Paste Colour: Black
Volume: 10 mL
Physical Form Texture: Greasy

Power
Not applicable.
Weight and Size Dimensions
Product Weight (including syringe): 38g

Product Size of unused syringe (L x W x H): 36 x 21 x 175 mm

product review

Thermal paste is used as a heat sink compound for thermal coupling of electronic devices and heatsinks. However, I really enjoy using Tayda's heat sink compound product for these following reasons:
1.  This product has high thermal conductivity to transfer heat between materials like aluminium, silicon etc.
2. The paste has a low bleed property, so that it won't easily seep onto other surfaces.
3. This thermal paste gives a very stable performance under high temperatures, meaning that thermal transfer will take place efficiently without any complications in the way.

​TAYDA ELECTRONICS PRODUCT PAGE

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Check out the product here: https://www.taydaelectronics.com/heat-sink-compounds-hy510-black.html

​​​​​ENJOY! CONTACT US FOR ANY INQUIRIES!

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