Type: Heat Sink Compound (Thermal Paste)
Architecture: For all electronics
Material: Silicone Fluid
Paste Colour: Black
Volume: 10 mL
Physical Form Texture: Greasy
Weight and Size Dimensions
Product Weight (including syringe): 38g
Product Size of unused syringe (L x W x H): 36 x 21 x 175 mm
Thermal paste is used as a heat sink compound for thermal coupling of electronic devices and heatsinks. However, I really enjoy using Tayda's heat sink compound product for these following reasons:
1. This product has high thermal conductivity to transfer heat between materials like aluminium, silicon etc.
2. The paste has a low bleed property, so that it won't easily seep onto other surfaces.
3. This thermal paste gives a very stable performance under high temperatures, meaning that thermal transfer will take place efficiently without any complications in the way.
TAYDA ELECTRONICS PRODUCT PAGE
Check out the product here: https://www.taydaelectronics.com/heat-sink-compounds-hy510-black.html